Power chips are connected to exterior circuits through product packaging, and their efficiency depends upon the assistance of the product packaging. In high-power scenarios, power chips are normally packaged as power modules. Chip interconnection describes the electrical link on the top surface of the chip, which is typically light weight aluminum bonding wire in typical components. ^
Standard power module bundle cross-section
Today, business silicon carbide power components still primarily utilize the product packaging innovation of this wire-bonded typical silicon IGBT module. They deal with problems such as huge high-frequency parasitic criteria, not enough warm dissipation ability, low-temperature resistance, and not enough insulation toughness, which limit using silicon carbide semiconductors. The display screen of superb performance. In order to fix these problems and totally manipulate the huge possible benefits of silicon carbide chips, lots of brand-new product packaging modern technologies and options for silicon carbide power components have actually emerged in recent years.
Silicon carbide power component bonding method
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have created from gold cord bonding in 2001 to light weight aluminum cord (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have established from gold wires to copper wires, and the driving pressure is expense reduction; high-power devices have actually developed from aluminum cables (strips) to Cu Clips, and the driving force is to boost item performance. The greater the power, the higher the requirements.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that makes use of a solid copper bridge soldered to solder to attach chips and pins. Compared to traditional bonding packaging techniques, Cu Clip innovation has the complying with advantages:
1. The connection in between the chip and the pins is made of copper sheets, which, to a certain extent, changes the typical wire bonding approach between the chip and the pins. As a result, an one-of-a-kind bundle resistance value, higher existing circulation, and much better thermal conductivity can be gotten.
2. The lead pin welding area does not require to be silver-plated, which can completely save the price of silver plating and bad silver plating.
3. The item look is entirely consistent with normal items and is mostly made use of in servers, portable computers, batteries/drives, graphics cards, motors, power supplies, and other areas.
Cu Clip has two bonding techniques.
All copper sheet bonding approach
Both eviction pad and the Resource pad are clip-based. This bonding technique is a lot more costly and complex, however it can attain better Rdson and far better thermal impacts.
( copper strip)
Copper sheet plus cable bonding method
The source pad utilizes a Clip technique, and the Gate makes use of a Cord technique. This bonding technique is somewhat less expensive than the all-copper bonding approach, conserving wafer location (suitable to extremely little gate areas). The process is less complex than the all-copper bonding method and can get much better Rdson and far better thermal effect.
Vendor of Copper Strip
TRUNNANOÂ is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper tube price, please feel free to contact us and send an inquiry.
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