Advanced ceramic materials, also known as precision ceramic materials, refer to products with excellent performance that is manufactured using refined, high-purity, ultra-fine inorganic compounds as raw materials and advanced preparation technology. According to the requirements of engineering technology for product performance, the manufactured products can have piezoelectric, ferroelectric, conductive, semiconductor, magnetic, etc. or have high strength, high toughness, high hardness, wear resistance, corrosion resistance, high-temperature resistance, high thermal conductivity, Excellent performance such as heat insulation or good biocompatibility.
Alumina ceramics have better overall performance and are currently the most mature in the application. Alumina ceramics are rich in raw materials, low in price, high in strength, hardness, heat shock resistance, insulation, chemical stability, and good adhesion to metals. Al2O3 is currently the main material for ceramic substrates. The Rockwell hardness of alumina ceramics is HRA80-90 determined by the Shanghai Institute of Ceramics, Chinese Academy of Sciences. The hardness is second only to diamond and far exceeds the wear resistance of wear-resistant steel and stainless steel. Measured by the Institute of Powder Metallurgy of Central South University, the wear resistance of alumina ceramics is equivalent to 266 times that of manganese steel and 171.5 times that of high-chromium cast iron. The density of alumina ceramics is 3.5g/cm3, which is only half of that of steel, which can greatly reduce the equipment load.
According to “Insight Partners” on “European alumina ceramic market forecast by 2027-COVID-19 impact and analysis-research by application (electronics and semiconductors, energy and power, military and defense, automotive, industry, medical, etc.)”, The alumina ceramic market is expected to grow from US$9.1174 billion in 2019 to US$1,130.20 million by 2027 and is expected to grow at a compound annual growth rate of 3.2% from 2020 to 2027.
Ceramic substrates can just meet the performance requirements of mid-to-high-end chips, and have been well applied in mid-to-high-end products in the fields of home appliance lighting, information communication, sensors, etc., and are ideal packaging materials for a new generation of large-scale integrated circuits and power electronic modules. The use of ceramic substrates has provided the impetus for the electronics and semiconductor industries.
The CMOS image sensor light signal acquisition method is active, and the charge generated by the photodiode is directly amplified and output by the transistor. When processing fast-changing images, the current will frequently change and the flow will increase, causing it to overheat. Affect the life and reliability of CMOS image sensors. Due to the small size of the CMOS image sensor, most of the heat cannot be dissipated from the surface. If you want to achieve better heat dissipation, you can only start from the substrate. With its high thermal conductivity (20~27W/m.K), Stone on alumina ceramic substrates can meet the high heat dissipation requirements of CMOS image sensors, and can further extend the product life cycle.
Reliable performance, ensuring the use of automotive sensors
Because the sensor in the car has been in a unique harsh environment (high temperature, low temperature, vibration, acceleration, humidity, noise, exhaust gas) for a long time, and should have the characteristics of small and light weight, good reusability, and wide output range. Ceramics, by virtue of their own high temperature resistance, vibration resistance, moisture resistance, and chemical resistance, can still protect the chip from corrosion even in a relatively harsh environment. Regardless of practicability or reliability, ceramic substrates can bring significant improvements to products. There is no doubt that ceramic substrates are the guarantee of product cost-effectiveness.
The alumina ceramic substrate is more in line with the future development direction of high density, high precision and high reliability. It is a more feasible choice and an important direction for the sustainable development of electronic packaging materials in the future.